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Materiale Plastice
Cite as: Mater. Plast.
https://doi.org/10.37358/Mat.Plast.1964

OSIM Nr. R102356
ISSN Print 0025-5289
ISSN Online 2668-8220
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Materiale Plastice (Mater. Plast.), Year 2014, Volume 51, Issue 4,





CATALIN GHEORGHE AMZA Automatic Inspection of Epoxy Die-attach Process of a Semiconductor Chip


Abstract:
This paper concerns with a method for automatic detection of voids as a result of epoxy die-attach process of a semiconductor chip to the package. A radiographic image is acquired from the inspected semiconductor chip and package and image processing techniques are employed in order to automatically compute the amount of epoxy die-attach voids. Keywords: image processing, X-ray imaging, image segmentation, artificial intelligence



Issue: 2014 Volume 51, Issue 4
Pages:
Publication date: 2014/12/30
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