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Materiale Plastice
Cite as: Mater. Plast.
https://doi.org/10.37358/Mat.Plast.1964

OSIM Nr. R102356
ISSN Print 0025-5289
ISSN Online 2668-8220
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Materiale Plastice (Mater. Plast.), Year 2006, Volume 43, Issue 2,





Nonlinear Thermal Impedance Electrical Model for Polymers Used in Electronic Industry


Abstract:
The microelectronic package continues to evolve in order to improve the performance and integrate new technology such as multidie architectures, thinner substrates, increasing integration of passive components, increasing thermal design power and lead free interconnects. Package materials must be designed to enable the electrical and thermal performance requirement and to provide high-reliability performance. Maximum heat dissipation is a requirement for today’s higher power integrated circuit devices. The maximum heat dissipation is achieved by mounting active devices directly to high thermal conductivity heat sinking substrates or packages. Direct attachment requires a compatible coefficient of thermal expansion (CTE) value of the heat sink material to avoid stress failure of the IC device. In this paper, the thermal behavior of polymers used in cooling electronics with nonlinear electrical lumped elements as a function of temperature, physical properties and sizes of a heat sink element were modeled. Keywords: high thermal conductivity polymers, heat sink, safe operating area, nonlinear thermal impedance electrical model



Issue: 2006 Volume 43, Issue 2
Pages:
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